SKYLAKE 6° generation of Intel® i Core™ processors

It is the introduction of a new technology. The lithography is unchanged, the same as the 5th generation Broadwell (tick phase after Haswell) to 14nm. It changed the socket passing from 1150 pin of Haswell and Broadwell generations to 1151 of the Skylake.

For this platform Intel® has defined two chipsets for the desktop world:

• Q170
• H110

The two chipsets are embedded (with a minimum life of 7 years from the launch date)

The Q170 is the full version of all the features available, while H110 is the cheaper version and has a smaller number of features.

Below are the main differences

• Number of DIMMs per channel, 2 for the Q170 and 1 for  H110.
• Display Support: 3 for Q170 and 2  for H110
• Maximum number of PCIe lanes: 20 (Gen 3) for Q170 and 6 (Gen 2) for H110
• USB Maximum number: 24 for the Q170, 14 for H110
• RAID: the Q170 supports 0,1,5,10 raid mode while H110 does not support any

The possibility of using DDR4 is one of the great innovations of Skylake. The DDR4 works with lower operating voltages and with a reduced consumption of energy.

We fournish 1.5V for DDR3 and 1.35V for the DDR3L compared to ‘1.2V of DDR4 and 1,05V of DDR4L.

In addition to a lower ram modules consumption, they also heat less  and this is certainly interesting for industrial applications.