Technical Features
| CPU | Qualcomm® Dragonwing IQ9075 System-On-Module Octa-Core Kyro Gen 6 |
|---|---|
| Chipset | – |
| RAM | Up to 36 GB LPDDR5 @ 3200MHz |
| LAN | LAN 1 to LAN 2 2.5GigE LAN RJ45 Connector (Optional X-coded M12 by rework) LAN 3 to LAN 6 GigE PoE+ LAN by Intel I350, RJ45 (Optional X-coded M12 by rework) |
| I/O | 2 x USB 3.1 Type A; 1 x USB 3.1 Type C (Image Port); 1 x Micro USB (Debug console); 2 x COM RS232/422/485 DB9 Connector (by cable); 16-bit x Isolated DIO (8DI, 8DO); 2 x Isolated CAN-FD DB9 Connector (by cable); 2 x Nano SIM Slot |
| Storage | 1 x M.2 Key M Socket (2280, PCIe x4) |
| Expansion | 2 x M.2 Key B Socket (3042/3052, USB 3.0, USB 2.0, with dual SIM); 1 x M.2 Key E Socket (2230/3042, PCIe x1, USB 2.0,UART) |
| Operative range | -40°C ÷ 70°C |
| Power | 9V ÷ 50V DC-IN (9V for power-on only) |
| Notes | CE, FCC, EN50155, EN50121-3-2 |