Solution provider for Embedded and Industrial PC
Caratteristiche generali

-BGA1356 for Intel ® Core i7/i5/i3/Celeron (Skylake U)
-Supports Dual Channel DDR4 SO-DIMM 2133, up to 32GB
-2 x DDI channels, 1 x eDP channel
-4 xUSB 3.0 SS, 8 x USB 2.0, 3 x SATA3, 2 x COM
-6 x PCIe x1 ( 1 for Giga Lan)
-1 x Intel LAN
-1 x TPM 2.0 on board IC (optional)

Caratteristiche Tecniche
FORM FACTOR
Dimension COM Express Compact Size 95 x 95mm (3.74 in x 3.74 in)
PROCESSOR SYSTEM
CPU BGA1356 forIntel ® Core i7/i5/i3/Celeron (SkylakeU)
Chipset N/A
EXPANSION SLOT
PCIe 6 x PCIe x1 Lane ( 1 for Giga Lan)
MEMORY
Technology Dual Channel DDR4 2133
Max 32GB
Socket 2 x SO-DIMM
GRAPHICS
Controller Intel ® Gen9 Graphics DX 11/12, OGL4.3/4.4,support 2x DDI, 1x eDP
Multi Display Triple Display
ETHERNET
Ethernet 10/100/1000 Mbps
Controller 1 x Intel LAN I219LM / I219V
INTERNAL CONNECTOR
USB 4 x USB 3.0 SS/ 8 x USB 2.0
Serial 2(RX/TX only)
SATA 3 x SATA3
GPIO 4 x GPI + 4 x GPO
TPM TPM 2.0 on board IC (optional)
Onboard SSD EMMC 32GB (optional)
Others LPC, SMBus, I2C, SPI, HD Audio
WATCHDOG TIMER
Interval 0 ~ 255 sec
POWER REQUIREMENTS
input PWR ATX: 12V±5%/5Vsb±5%, or AT: 12V±5%
ENVINROMENT
Temperature 0°C to 60°C
Storage Temperature -40ºC – 85° C

Contattaci per maggiori informazioni su COM Express Compact COM-651