Solution provider for Embedded and Industrial PC
Caratteristiche generali

-COM Express Compact Size
-Intel® Braswell SoC Processor
-Supports DDR3L 1333/1600MHz, 2 x SO-DIMM, up to 8GB system memory
-3 x DDI channels, 1 x eDP channel
-7 x PCIe x1 Lanes (1 for Intel I211AT GbE)
-4 x USB SS, 8 x USB 2.0, 2 x SATA 3

Caratteristiche Tecniche
PROCESSOR SYSTEM
Dimension COM Express Compact Size 95x95mm (3.74-in x 3.74-in)
CPU N3160,QC, 1.60 GHz, 6 W
Chipset SoC
EXPANSION SLOT
PCIe 7 x PCIe x1 Lane
Mini-PCIe By Carrier Board
M.2 N/A
mSATA By Carrier Board
MEMORY
Technology DDR3L 1333/1600 MHz
Max 8GB
Socket 2 x SO-DIMM
GRAPHICS
Controller Intel® HD Graphics
VGA N/A
LVDS Supports max resolution up to 1920 x 1200@60Hz
eDP N/A
HDMI Supports max resolution up to 1920 x 1200
DVI N/A
DisplayPort Supports max resolution up to 2560 x 1600
Multi Display Triple Display
REAR I/O
VGA 1 (Shared with DP)
DVI N/A
HDMI 1 (By Carrier Board)
DisplayPort 2 (By Carrier Board)
Ethernet 1 (By Carrier Board)
USB 4 x USB 3.0 (By Carrier Board)
Audio Jack 3 (Mic-in, Line-in, Line-out)
Serial 2
PS/2 1 (By Carrier Board)
INTERNAL CONNECTOR
USB 2 x USB 2.0 (By Carrier Board)
LVDS 1 (By Carrier Board)
eDP N/A
VGA N/A
Serial 2 x TX/RX Only (By Carrier Board)
SATA 4 x SATA3 (By Carrier Board)
Parallel 1 (By Carrier Board)
GPIO 4 x GPI + 4 x GPO (By Carrier Board)
SATA PWR Output Con 1 (By Carrier Board)
Speaker Header N/A
TPM N/A
WATCHDOG TIMER
Interval 1,2…255 Sec
POWER REQUIREMENTS
Input PWR By Carrier Board
Power On By Carrier Board
ENVINROMENT
Temperature 0ºC–60ºC
Storage Temperature -40ºC – 85° C

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