|TPole presents SKYLAKE, the 6th generation of desktop processors Intel® i Core™|
|Skylake is the name that Intel® has chosen for the 6th generatio of desktop processors i Core™.|
It is the introduction of a new technology. The lithography is unchanged, the same as the 5th generation Broadwell (tick phase after Haswell) to 14nm. It changed the socket passing from 1150 pin of Haswell and Broadwell generations to 1151 of the Skylake.
For this platform Intel® has defined two chipsets for the desktop world:
The two chipsets are embedded (with a minimum life of 7 years from the launch date)
The Q170 is the full version of all the features available, while H110 is the cheaper version and has a smaller number of features.
Below are the main differences
- Number of DIMMs per channel, 2 for the Q170 and 1 for H110.
- Display Support: 3 for Q170 and 2 for H110
- Maximum number of PCIe lanes: 20 (Gen 3) for Q170 and 6 (Gen 2) for H110
- USB Maximum number: 24 for the Q170, 14 for H110
- RAID: the Q170 supports 0,1,5,10 raid mode while H110 does not support any
Skylake: benchmark of some i7 processors
Below the benchmark data for some i7 processors from the Skylake family chosen for different TDP and clock values:
- Intel® Core ™ i7-6700T Processor 8M Cache, up to 3.60 GHz, 35W TDP
- Intel® Core ™ i7-6700 Processor 8M Cache, up to 4:00 GHz, 65W TDP
- Intel® Core ™ i7-6700K Processor 8M Cache, up to 4.20 GHz, 91W TDP
All the three processors have 4 physical cores + 4 logic, the same GPU integrated HD graphics 530 but different clock.
Obviously with the increase of the clock you will get better performances, the TDP increases and is accurate to evaluate the thermal impact to properly size the cooling system.
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Skylake and DDR4
|The Skylake processors support both DDR3 / L memories and DDR4 / L, so it will be possible to find boards that, despite having the same architecture, support different RAM, for example. DFI on the boards with H110 mounted DDR3 / L.|
The possibility of using DDR4 is one of the great innovations of Skylake. The DDR4 works with lower operating voltages and with a reduced consumption of energy.
We fournish 1.5V for DDR3 and 1.35V for the DDR3L compared to ‘1.2V of DDR4 and 1,05V of DDR4L.
In addition to a lower ram modules consumption, they also heat less and this is certainly interesting for industrial applications.
|HD Graphics 530 is the name that Intel has given to the new integrated GPU on Skylake processors and represents a major innovation of this family of processors.Some important aspects are:|
- excellent performance
- support DirectX 12
- Support of Open CL2,0
- support of Open GL 4.4
- Support of Ultra HD 4K resolution
The first important aspect is that of the services, the numeric data expressed as a benchmark CPU is actually very indicative:
mini ITX SKYLAKE Boards
|We present two mini ITX Skylake boards, one based on chipset H110 and the other on Q170 chipset.|
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